The utility model relates to a new type of semiconductor air-conditioning fan, which includes: an air ring, a base, a motor, an impeller, a partition, a semiconductor refrigeration sheet, a heat conduction fin, an air inlet hole, a circuit board, a switch, a heat pipe, a refrigeration and heating box, Cooling and heating box insulation shell, heat exchange cavity, cold compartment, hot compartment door, hot compartment cover, counterweight block. By connecting the heat pipe at one end of the semiconductor cooling sheet to quickly conduct cold or heat, and make full use of the exported cold or heat, it not only improves the working efficiency of the semiconductor cooling sheet, but also improves the efficiency of energy use. Contents of Utility Model The purpose of the utility model is to overcome the shortcomings of the prior art and provide a novel multifunctional semiconductor refrigeration fan that can perform refrigeration, has high energy efficiency, and is convenient and safe to use. In order to solve the above problems, a technical solution adopted by the present utility model is: a semiconductor refrigeration fan, including: a mesh cover, a fan blade, a rotor, a motor, a semiconductor refrigeration sheet, a heat pipe, a heat bin, a heat bin cover, a column, Circuit board, switch, clump weight, base. The net cover is formed by bending and combining a single heat pipe, one end of the single heat pipe is connected to the upper part of the semiconductor refrigeration plate, and the other end is connected to the lower part of the semiconductor refrigeration plate after being bent. All heat pipes cross at the center of the circle in the front of the net cover; The heat pipe is a heat transfer element with extremely high thermal conductivity, which transfers heat through the evaporation and condensation of liquid in the fully enclosed vacuum tube, heat pipe can transfer heat and speed is silver, copper and other metals hundreds of times. The rotation of the wind blade forms an air flow to realize the cold transfer between the air and the heat exchange net cover, thereby blowing out cool wind. One end of the rotor is connected to the fan blade, and the other end is connected to the motor, and the rotation of the fan blade is driven by the rotation of the rotor. The rotating shaft of the motor faces to the left and is connected to the rotor, and the rotating speed is 1000 to 10000 revolutions per minute. The semiconductor refrigeration sheet is fixed on the back and top of the mesh cover. The semiconductor refrigeration sheet is formed by arranging many N-type and P-type semiconductor particles with each other, and the NPs are connected by general conductors to form a complete circuit, usually copper, aluminum or other metal conductors. Finally, two ceramic sheets are sandwiched together like sandwich biscuits, and the ceramic sheets are insulated and have good heat conduction. When the current passes, heat transfer occurs between the two ceramic sheets of the semiconductor refrigeration sheet, and the heat is transferred from one end to the other end, thereby generating a temperature difference to form a cold and hot end. The semiconductor cooling fan comprises one or more semiconductor cooling plates, and when there are multiple cooling plates, the cold and hot end directions thereof are consistent. The heat conduction tube is a closed metal shell, which is pumped into a negative pressure and filled with an appropriate amount of refrigerant. One end of the tube is an evaporation section, and the other end is a condensation section. When one end of the heat conduction tube is heated, the refrigerant evaporates and vaporizes. The refrigerant flows to the other end under a slight pressure difference to release heat and recondenses into a liquid. The liquid flows back to the evaporation section by gravity, and circulates in this way, heat is transferred from one end of the heat pipe to the other end. One end of the heat pipe is thermally connected to the lower end of the semiconductor cooling sheet, and the other end is bent and extends to the heat bin. The semiconductor cooling fan includes a plurality of heat pipe. The inner wall of the heat bin is made of aluminum, copper or other metal with good thermal conductivity. The top of the hot bin has a hot bin cover, and when heating is required, items can be put in from the hot bin cover. The upright post is formed by combining two cylinders, and the bottom of the upright post is connected to the base. The circuit board is located in a region where the air inlet holes are distributed, and the circuit board electrically connects the power supply to the motor and the semiconductor refrigeration sheet. The switch is located in an area where the air inlet holes are distributed and its toggle button is located on the housing. The switch is used to select the working state of the semiconductor cooling fan: off and working. When the switch is turned off, the power supply is cut off and the semiconductor cooling fan does not work; when the switch is turned to the working state, the positive pole of the power supply is connected to the N-type semiconductor of the semiconductor cooling sheet, and the negative pole of the power supply is connected to the P-type semiconductor of the semiconductor cooling sheet. The left end of the cooling sheet cools, and the wind blown by the semiconductor cooling fan is cold air. The weight is made of high-density metal and is located at the bottom of the column to lower the center of gravity of the semiconductor cooling fan. The base is of a short cylindrical shape, and is connected with the upright post for keeping the semiconductor cooling fan upright. Compared with the prior art, the utility model adopts the above technical scheme, and the beneficial effect is that the semiconductor refrigeration fan can not only cool, but also conduct the heat on the other side to the heat bin by using the heat pipe, and the energy can be fully utilized. Six patents have been applied for related technologies, two of which have been authorized (authorization numbers: ZL201920795632.X,ZL 201920828391.4), and four of which are under review, and the development of the first generation of products has been completed.